AMAOE MI9 0.12mm SDM845/SDM710 CPU BGA Reballing Stencil for Xiaomi Mi 8/8 SE/Mi MIX 2S

Name: AMAOE MI9 0.12mm SDM845/SDM710 CPU BGA Reballing Stencil for Xiaomi Mi 8/8 SE/Mi MIX 2S
Brand: AMAOE
SKU: MI-9
Availability: InStock

₹179.00

Brand: AMAOE

Model: MI-9

Availability: In Stock

Qty

🚚 Check Delivery Availability

Add to wishlist
Add to compare

Tags: MI9 Stencil SDM845 Stencil BGA Reballing

Categories Cart Account Search Recent View Go to Top

Description
Shipping Methods

Product Description

AMAOE MI9 is a 0.12mm CPU BGA reballing stencil designed for Qualcomm Snapdragon 845 (SDM845) and Snapdragon 710 (SDM710) processor reballing. It is compatible with Xiaomi Mi 8, Mi 8 SE and Mi MIX 2S for motherboard repair and CPU BGA reballing applications.

Model: MI9
Thickness: 0.12mm
Compatible CPUs: Qualcomm Snapdragon 845 / Snapdragon 710
CPU Codes: SDM845 / SDM710
Compatible Devices: Xiaomi Mi 8, Mi 8 SE, Mi MIX 2S
Application: CPU BGA Reballing and Motherboard Repair
Package: 1 × Stencil

Show More Show Less

🚚 Shipping & Delivery Information

UToolsZone Fast & Reliable Delivery

When you place an order on UToolsZone, you will receive an order confirmation email instantly. Once your order is shipped, we will send you a tracking number so you can track your package easily. During checkout, you can choose your preferred shipping method based on your location and delivery speed.

📦 Estimated Delivery Time

Total delivery time = Processing Time + Shipping Time

📦 Processing Time

Time required to prepare your order including order verification, quality check, and secure packaging before dispatch.

✈️ Shipping Time

Shipping time refers to the duration your package takes to travel from our warehouse to your address.

🌍 Important Note

Delivery time may vary based on location, courier service, and external delays like customs or weather conditions. For any issue, contact our support team anytime.